OEM receives approval of patent number 8.510,948 relating to “methods and systems for forming slots in a semiconductor substrate”.
The patent was filed on 17 April 2007 and has now been assigned to HP, who invented the method to “provide fast and economical methods for forming print heads and other fluid ejecting devices having desirable characteristics” as the demand from consumers for higher print resolution, realistic colours and increased print speeds at an affordable price increases.
USPTO describes the patent as relating to “a method of fabricating a fluid feed slot in a print head substrate”, with the method involving the creation of a “saw cut” into a substrate’s “first surface” using a cutting disk and removing material from a second surface on the opposite side of the substrate.
It adds that the slots “can be inexpensive and quick to form” and “can be made as long as desirable and have beneficial strength characteristics that can reduce the die fragility and allow slots to be positioned closer together on the die”.
While the invention lists specific steps to take, it is stated that the invention “is not necessarily limited to the specific features or steps described” but that these are the “preferred forms of implementing the claimed invention”.